hotwav T7 Pro vs Samsung Galaxy XCover 7

W skrócie

Marka: Hotwav; Samsung
Data premiery: czerwiec 2024, 2 lat temu; styczeń 2024, 2 lat 5 miesięcy temu
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Rozmiar: 6.6"; 6.6"
Rozdzielczość: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Typ: LCD IPS; TFT LCD (IPS)
Gęstość: 407 ppi Very high density; 418 ppi Very high density
Proporcje ekranu: 21:9; 20:9
Funkcje: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Scratch resistant, Corning Gorilla Glass Victus+, Capacitive, Multi-touch

Procesor: MediaTek MT8788V; MediaTek Dimensity 6100+
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x2.2 GHz ARM Cortex A76 +6x2.0 GHz ARM Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 6 nm
Częstotliwość: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; ARM Mali-G57 MC2
RAM: 6 GB; 6 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 64 Mpx; 50 Mpx
Przysłona: Unknow; ƒ/ 1.8
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Funkcje: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Wymiary: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 80.1 mm 169.0 mm 10.2 mm Print 3D Model
Waga: 292 g; 240 g
Materiały: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Polycarbonate
Kolory: Black Orange; Black
Odporność na wodę/pył: IP68, IP69 , MIL-STD-810H; IP68, MIL-STD-810H
Odporność na upadki: Class A B C D E 270 drops without defects; —
Naprawialność: Class A B C D E; —
Powierzchnia użytkowa: 71 %; 78 %

System operacyjny: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services
Aktualizacje: —; OS updates: 2 years, Security updates: 4 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + eSIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi MiMO
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)