hotwav T7 Pro vs Meizu mblu 21

W skrócie

Marka: Hotwav; Meizu
Data premiery: czerwiec 2024, 1 lat 11 miesięcy temu; listopad 2024, 1 lat 6 miesięcy temu
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 239.300 Antutu v10 Overall performance better than 57% of devices

Rozmiar: 6.6"; 6.79"
Rozdzielczość: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Typ: LCD IPS; LCD IPS
Gęstość: 407 ppi Very high density; 264 ppi Medium Density
Proporcje ekranu: 21:9; 20:9
Funkcje: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Procesor: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 12 nm
Częstotliwość: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
RAM: 6 GB; 4 GB
Typ RAM: LPDDR4X RAM; —
64-bit: Yes; Yes

Rozdzielczość: 64 Mpx; 13 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Wielkość piksela: —; 0.80 µm

Wymiary: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 78.0 mm 170.8 mm 9.4 mm Print 3D Model
Waga: 292 g; 196 g
Materiały: Rugged Smartphone, Plastic , Faux leather; Plastic
Kolory: Black Orange; Black White Blue
Odporność na wodę/pył: IP68, IP69 , MIL-STD-810H; —
Odporność na upadki: Class A B C D E 270 drops without defects; —
Naprawialność: Class A B C D E; —
Powierzchnia użytkowa: 71 %; 82 %

System operacyjny: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; —
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850)