hotwav T7 Pro vs hotwav T7S

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Marka: Hotwav; Hotwav
Data premiery: June 2024, 1 year ago; January 2025, 1 year ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Rozmiar: 6.6"; 6.52"
Rozdzielczość: 1080 x 2460 px FHD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 407 ppi Very high density; 407 ppi Very high density
Proporcje ekranu: 21:9; 21:9
Funkcje: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Procesor: MediaTek MT8788V; MediaTek MT8788V
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 12 nm
Częstotliwość: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Mali-G72 MP3
RAM: 6 GB; 4 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 64 Mpx; 21 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony Exmor

Pojemność: 256 GB; 128 GB
Typ: eMMC 5.1 Storage; eMMC 5.1 Storage
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Waga: 292 g; 310 g
Materiały: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Plastic , Faux leather
Kolory: Black Orange; Black Green
Odporność na wodę/pył: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Odporność na upadki: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Naprawialność: Class A B C D E; Class A B C D E
Powierzchnia użytkowa: 71 %; 71 %

System operacyjny: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)