hisense A9 Pro vs Xiaomi Redmi 13X

W skrócie

Marka: HiSense; Xiaomi
Data premiery: marzec 2023, 3 lat 3 miesięcy temu; marzec 2025, 1 lat 3 miesięcy temu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Rozmiar: 6.1"; 6.79"
Rozdzielczość: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Typ: eInk E INK Carta 1200; LTPS LCD
Gęstość: 302 ppi High Density; 388 ppi High Density
Proporcje ekranu: 18:9; 19.5:9
Funkcje: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Max brightness HBM - 550 cd/m², Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Procesor: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 11 nm; 12 nm
Częstotliwość: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
RAM: 8 GB; 6 GB
64-bit: Yes; Yes

Rozdzielczość: 13 Mpx; 108 Mpx
Przysłona: Unknow; ƒ/ 1.8
Lampa błyskowa: LED; Quad LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Pojemność: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Wymiary: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Waga: 183 g; 205 g
Materiały: Plastic; Plastic , P2i Nano coating , Splash resistant design
Kolory: Black; Black Cyan
Powierzchnia użytkowa: 76 %; 94 %

System operacyjny: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)