hisense A9 Pro vs Oukitel WP23 Plus

W skrócie

Marka: HiSense; Oukitel
Data premiery: marzec 2023, 3 lat 3 miesięcy temu; marzec 2025, 1 lat 3 miesięcy temu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 251.400 Antutu v10 Overall performance better than 59% of devices

Rozmiar: 6.1"; 6.52"
Rozdzielczość: 824 x 1648 px FHD; 720 x 1600 px HD+
Typ: eInk E INK Carta 1200; LCD IPS
Gęstość: 302 ppi High Density; 269 ppi Medium Density
Proporcje ekranu: 18:9; 20:9
Funkcje: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch

Procesor: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 11 nm; 12 nm
Częstotliwość: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozdzielczość: 13 Mpx; 13 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony IMX135 Exmor RS
Wielkość piksela: —; 1.12 µm
Rozmiar matrycy: —; 1/3.06"

Pojemność: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.0 mm 176.0 mm 17.0 mm Print 3D Model
Waga: 183 g; 360 g
Materiały: Plastic; Rugged Smartphone, Polycarbonate , Metal
Kolory: Black; Black Green Orange
Powierzchnia użytkowa: 76 %; 80 %
Odporność na wodę/pył: —; IP68, IP69 , MIL-STD-810H
Odporność na upadki: —; Class A B C D E 270 drops without defects
Naprawialność: —; Class A B C D E

System operacyjny: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)