hisense A9 Pro vs hotwav Cyber X

W skrócie

Marka: HiSense; Hotwav
Data premiery: marzec 2023, 3 lat 2 miesięcy temu; lipiec 2023, 2 lat 10 miesięcy temu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Rozmiar: 6.1"; 6.78"
Rozdzielczość: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Typ: eInk E INK Carta 1200; LCD IPS
Gęstość: 302 ppi High Density; 396 ppi High Density
Proporcje ekranu: 18:9; 21:9
Funkcje: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Procesor: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 11 nm; 6 nm
Częstotliwość: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozdzielczość: 13 Mpx; 64 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: LED; Dual LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony IMX686 Exmor RS
Wielkość piksela: —; 0.80 µm
Rozmiar matrycy: —; 1/1.7"

Pojemność: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 85.1 mm 181.8 mm 17.5 mm Print 3D Model
Waga: 183 g; 380 g
Materiały: Plastic; TPU , Rugged Smartphone
Kolory: Black; Black
Powierzchnia użytkowa: 76 %; 70 %
Odporność na wodę/pył: —; IP68, MIL-STD-810G , IP69

System operacyjny: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)