Cubot X70 vs Oukitel WP23 Plus

W skrócie

Marka: Cubot; Oukitel
Data premiery: maj 2023, 3 lat 1 miesięcy temu; marzec 2025, 1 lat 3 miesięcy temu
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 251.400 Antutu v10 Overall performance better than 59% of devices

Rozmiar: 6.58"; 6.52"
Rozdzielczość: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Typ: LCD IPS; LCD IPS
Gęstość: 401 ppi Very high density; 269 ppi Medium Density
Proporcje ekranu: 20:9; 20:9
Funkcje: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Water Drop Notch, Brightnes 400 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch

Procesor: MediaTek Helio G99 (MT6789); Unisoc Tiger T606
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 6 nm; 12 nm
Częstotliwość: 2.2 GHz; 1.6 GHz
GPU: Mali-G57 MC2; ARM Mali-G57
RAM: 12 GB; 8 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 100 Mpx; 13 Mpx
Przysłona: Unknow; Unknow
Wielkość piksela: 0.80 µm; 1.12 µm
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony IMX135 Exmor RS
Rozmiar matrycy: —; 1/3.06"

Pojemność: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 84.0 mm 176.0 mm 17.0 mm Print 3D Model
Waga: 220 g; 360 g
Materiały: Metal; Rugged Smartphone, Polycarbonate , Metal
Kolory: Black Aurora Black; Black Green Orange
Powierzchnia użytkowa: 83 %; 80 %
Odporność na wodę/pył: —; IP68, IP69 , MIL-STD-810H
Odporność na upadki: —; Class A B C D E 270 drops without defects
Naprawialność: —; Class A B C D E

System operacyjny: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)