Cubot KingKong Power vs hotwav Cyber 15

W skrócie

Marka: Cubot; Hotwav
Data premiery: kwiecień 2023, 3 lat 2 miesięcy temu; maj 2024, 2 lat 1 miesięcy temu
AnTuTu: 224.235 Antutu v9 Overall performance better than 56% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Rozmiar: 6.58"; 6.6"
Rozdzielczość: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 401 ppi Very high density; 396 ppi High Density
Proporcje ekranu: 20:9; 21:9
Funkcje: Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Procesor: MediaTek MT8788V; MediaTek Helio G99 (MT6789)
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 6 nm
Częstotliwość: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; Mali-G57 MC2
RAM: 8 GB; 12 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 48 Mpx; 200 Mpx
Przysłona: Unknow; ƒ/ 1.8
Wielkość piksela: 0.80 µm; —
Lampa błyskowa: LED; Dual LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Samsung S5KHP3SP
Rozmiar matrycy: —; 1/1.4"

Pojemność: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 80.2 mm 169.9 mm 20.0 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Waga: 382 g; 290 g
Materiały: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Kolory: Black; Black
Odporność na wodę/pył: IP68, IP69; IP68, MIL-STD-810G , IP69
Powierzchnia użytkowa: 76 %; 67 %
Odporność na upadki: —; Class A B C D E 270 drops without defects
Naprawialność: —; Class A B C D E

System operacyjny: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)