Cubot Kingkong Mini 4 vs hotwav T7S

W skrócie

Marka: Cubot; Hotwav
Data premiery: listopad 2025, 6 miesięcy temu; styczeń 2025, 1 lat 4 miesięcy temu
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Rozmiar: 4.7"; 6.52"
Rozdzielczość: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 373 ppi High Density; 407 ppi Very high density
Proporcje ekranu: 20:9; 21:9
Funkcje: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Procesor: Unisoc Tiger T616; MediaTek MT8788V
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 12 nm
Częstotliwość: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; Mali-G72 MP3
RAM: 6 GB; 4 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 48 Mpx; 21 Mpx
Przysłona: ƒ/ 1.8; Unknow
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony Exmor

Pojemność: 128 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Wymiary: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Waga: 192 g; 310 g
Materiały: Rugged Smartphone, Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Kolory: Black Red Green Orange; Black Green
Odporność na wodę/pył: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Odporność na upadki: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Naprawialność: Class A B C D E; Class A B C D E
Powierzchnia użytkowa: 68 %; 71 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)