Cubot KingKong ES vs hotwav Cyber 15

W skrócie

Marka: Cubot; Hotwav
Data premiery: sierpień 2024, 1 lat 9 miesięcy temu; maj 2024, 2 lat temu
AnTuTu: 225.000 Antutu v10 Overall performance better than 56% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Rozmiar: 6.56"; 6.6"
Rozdzielczość: 720 x 1612 px HD+; 1080 x 2408 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 269 ppi Medium Density; 396 ppi High Density
Proporcje ekranu: 20:9; 21:9
Funkcje: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Procesor: Unisoc Tiger T606; MediaTek Helio G99 (MT6789)
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 6 nm
Częstotliwość: 1.6 GHz; 2.2 GHz
GPU: ARM Mali-G57; Mali-G57 MC2
RAM: 6 GB; 12 GB
Typ RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Rozdzielczość: 48 Mpx; 200 Mpx
Przysłona: Unknow; ƒ/ 1.8
Lampa błyskowa: Dual LED; Dual LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Samsung S5KHP3SP
Rozmiar matrycy: —; 1/1.4"

Pojemność: 128 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Wymiary: 81.2 mm 172.6 mm 12.8 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Waga: 268 g; 290 g
Materiały: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Kolory: Black Orange; Black
Odporność na wodę/pył: IP68, IP69; IP68, MIL-STD-810G , IP69
Odporność na upadki: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Naprawialność: Class A B C D E; Class A B C D E
Powierzchnia użytkowa: 73 %; 67 %

System operacyjny: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.1
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)