Cubot A10 vs hotwav T7 Pro

W skrócie

Marka: Cubot; Hotwav
Data premiery: maj 2024, 2 lat temu; czerwiec 2024, 1 lat 11 miesięcy temu
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Rozmiar: 6.56"; 6.6"
Rozdzielczość: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 269 ppi Medium Density; 407 ppi Very high density
Proporcje ekranu: 20:9; 21:9
Funkcje: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Procesor: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 12 nm; 12 nm
Częstotliwość: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 4 GB; 6 GB
64-bit: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozdzielczość: 48 Mpx; 64 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: Dual LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, HDR, Face detection, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Pojemność: 128 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Wymiary: 75.5 mm 165.6 mm 10.4 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Waga: 200 g; 292 g
Materiały: Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Kolory: Black Blue Purple; Black Orange
Odporność na upadki: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Naprawialność: Class A B C D E; Class A B C D E
Powierzchnia użytkowa: 82 %; 71 %
Odporność na wodę/pył: —; IP68, IP69 , MIL-STD-810H

System operacyjny: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)