coolpad X100 vs Cubot KingKong 11

W skrócie

Marka: Coolpad; Cubot
Data premiery: maj 2025, 1 lat temu; lipiec 2025, 10 miesięcy temu
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 470.000 Antutu v10 Overall performance better than 72% of devices

Rozmiar: 6.78"; 6.72"
Rozdzielczość: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Typ: LCD IPS; LCD IPS
Gęstość: 396 ppi High Density; 400 ppi Very high density
Proporcje ekranu: 20:9; 20:9
Funkcje: Hole-punch Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), DCI-P3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, Corning Gorilla Glass, Capacitive, Multi-touch

Procesor: MediaTek Helio G99 (MT6789); MediaTek Dimensity 7025
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x2.5 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 6 nm; 6 nm
Częstotliwość: 2.2 GHz; 2.5 GHz
GPU: Mali-G57 MC2; IMG BXM-8-256
RAM: 8 GB; 16 GB
Typ RAM: LPDDR4X RAM; RAM LPDDR5
64-bit: Yes; Yes

Rozdzielczość: 108 Mpx; 108 Mpx
Przysłona: ƒ/ 1.69; ƒ/ 1.89
Lampa błyskowa: LED; Dual LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Funkcje: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision
Matryca: —; Samsung HM6
Wielkość piksela: —; 0.61 µm
Rozmiar matrycy: —; 1/1.67"

Wymiary: 76.3 mm 169.0 mm 8.8 mm Print 3D Model; 84.1 mm 176.0 mm 18.7 mm Print 3D Model
Waga: 213 g; 388 g
Materiały: Polycarbonate; TPU , Rugged Smartphone
Kolory: Black Blue Silver Pink; Black
Odporność na wodę/pył: IP54; IP68, IP69 , MIL-STD-810H
Powierzchnia użytkowa: 84 %; 73 %
Odporność na upadki: —; Class A B C D E 90 drops without defects
Naprawialność: —; Class A B C D E

System operacyjny: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 6.0; Bluetooth 5.1 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; —
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)